b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 features: 1. emitted color : super blue 2. lens appearance : water clear 3. mono-color type. 4. 3.2x1.0x1.7mm(12 04) standard package 5. suitable for all smt assembly methods. 6. compatible with infrared and vapor phase reflow solder process. 7. compatible with automatic placement equipment. 8. this product doesn?t contain restriction substance, comply rohs standard. applications: 1. automotive : dashboards, stop lamps, turn signals. 2. backlighting : lcds, key pads advertising. 3. status indicators : comsumer & industrial electronics. 4. general use. absolute maximum ratings(ta=25 ) parameter symbol rating unit power dissipation pd 120 mw forward current i f 30 ma peak forward current 1 i fp 100 ma reverse volage v r 5 v operating temperature topr -25 ~80 - storage temperature tstg -30 ~85 - soldering temperature tsol see page6 - 1 condition for ifp is pulse of 1/10 duty and 0.1msec width. package dimensions: notes: 1.all dimensions are in millimeters (inches). 2.tolerance is 0.10mm (0.004?) unless otherwise specified. 3.specifications are subject to change without notice. ver.1.2 page 1 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 electrical and optical characteristics(ta=25 ) parameter symbol condition min. typ. max. unit forward voltage vf i f =5ma - 2.8 3.2 v luminous intensity iv i f =5ma 12.3. 30 - mcd reverse current i r v r =5v - - 1 a peak wave length p i f =5ma - 460 - nm dominant wave length d i f =5ma 465 - 470 nm spectral line half-width ? i f =5ma - 30 - nm veiwing angle 2 1/2 i f =5ma - 105 - deg typical electro-optical characteristics curves 2.0 30 forward current (ma) relative luminous intensity (@20ma) 0 10 20 0.5 1.0 1.5 relative radiant intensity 40 50 wavelength (nm) fig.3 forward current vs. forward voltage vs. forward current fig.5 relative luminous intensity forward voltage(v) forward current (ma) 10 1 0 2 20 30 40 50 410 0 460 1.5 (normalized @20ma) relative luminous intensity fig.6 radiation diagram ambient temperature ta( c) 4 35 0 -40 0.5 1.0 0 -20 20 60 40 2.0 2.5 3.0 510 0 fig.4 relative luminous intensity vs. ambient temperature ambient temperature ta( c) 40 20 60 100 80 fig.1 relative intensity vs. wavelength relative radiant intensity 0.5 1.0 fig.2 forward current derating curve forward current (ma) 20 10 10 30 40 50 60 vs. ambient temperature 0.7 0.8 0.9 1.0 90 80 0.5 0.3 0.1 0.4 0.2 0.6 30 50 70 60 40 010 20 ver.1.0 page 2 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 tapping and packaging speci fications(units: mm) 0.1 user direction of feed anode start cathode 0.05 5.3 4.0 end note: 3000 pcs per reel 2.0 0.05 4.0 0.1 1.5 0.1 1.75 0.1 0.05 3.5 0.3 8.0 71.0 1 0.3 3.43 0.1 1.88 0.1 1.22 0.1 fixing tape trailer leader 0.5 13.0 179 1 17.2 1.2 package method:(unit:mm) 470 245 220 aluminum foil bag bar code label 3000 pcs/reel 220 6 box/carton 645 210 185 12 bag/box 200 ver.1.0 page 3 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 bin limits intensity bin limits (at 5ma) bin code min. (mcd) max. (mcd) k 11.0 21.0 l 16.0 32.0 m 24.0 48.0 n 37.0 72.0 color bin limits (at 5ma) bin code min. (nm) max. (nm) 4 464 471 v f bin limits (at 5ma) bin code min.(v) max.(v) e 2.35 2.65 f 2.55 2.85 g 2.75 3.05 h 2.95 3.25 bin x x x v f bin code color bin code intensity bin code ver.1.0 page 4 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 reliability test classification test item reference standard test conditions result operation life mil-std-750:1026 mil-std-883:1005 jis-c-7021 :b-1 connect with a power if=20ma ta=under room temperature test time=1,000hrs 0/20 high temperature high humidity storage mil-std-202:103b jis-c-7021 :b-11 ta=+65 5 rh=90%-95% test time=240hrs 0/20 high temperature storage mil-std-883:1008 jis-c-7021 :b-10 high ta=+85 5 test time=1,000hrs 0/20 endurance te s t low temperature storage jis-c-7021 :b-12 low ta=-35 5 test time=1,000hrs 0/20 temperature cycling mil-std-202:107d mil-std-750:1051 mil-std-883:1010 jis-c-7021 :a-4 -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min test time=5cycle 0/20 thermal shock mil-std-202:107d mil-std-750:1051 mil-std-883:1011 -35 5 ~+85 5 20min 20min te s t ti m e = 1 0 c y c l e 0/20 environmental te s t solder resistance mil-std-202:201a mil-std-750:2031 jis-c-7021 :a-1 preheating 140 -160 ,within 2 minutes. operation heating 235 (max.), within 10seconds. (max.) 0/20 judgment criteria of failure for the reliability measuring items symbol measuring conditions judgement criteria for failure forward voltage v f ( v) i f =20ma over ux1.2 reverse current i r (ua) v r =5v over ux2 luminous intensity iv ( mcd ) i f =20ma below sx0.5 note: 1.u means the upper limit of specified characteristics. s means initial value. 2.measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. ver.1.0 page 5 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 3 3 3 3 4 4 c c - - t t r r b b since 1981 soldering : 1. manual of soldering the temperature of the iron tip should not be higher than 300 (572 H ) and soldering within 3 seconds per solder-land is to be observed. 2. reflow soldering preheating : 140 ~160 5 ,within 2 minutes. operation heating : 235 (max.) within 10 seconds.(max) gradual cooling (avoid quenching). 3. dip soldering (wave soldering) : preheating : 120 ~150 ,within 120~180 sec. operation heating : 245 5 within 5 sec.260 (max) gradual cooling (avoid quenching). handling : care must be taken not to cause to the epoxy resin portion of bright leds while it is exposed to high temperature. care must be taken not rub the epoxy resin portion of bright leds with hard or sharp article such as the sand blast and the metal hook . temperature time over 2 min. 4 /sec. max. 4 /sec. max. 10 sec. max. 235 max. 140~160 temperature time 120~180 sec. preheat 245 5 within 5 sec. soldering heat max. 260 120~150 ver.1.0 page 6 of 7
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